Tech news : Honor Magic 8 Pro Air and Honor Magic 8 RSR Porsche Design smartphones will be launched in the Chinese market on January 19, and so far many details to these devices have been revealed online. Today, some new features of these upcoming devices have been shared online.

Read :- Honor Magic 8 Pro with Snapdragon 8 Elite Gen 5 SoC and 200MP camera launched in global market

The Honor Magic 8 Pro Air smartphone comes with Honor Cicada Wing Architecture and aerospace aluminum integrated mid-frame that can easily withstand bending and pressure. It is said that its body is thin and light. The device supports multiple focal lengths – 74mm, 46mm and 23mm. This device supports quad SIM and dual standby. It supports both eSIM and physical SIM.

Magic 8 Pro Air has IP69+IP68 dust and water resistance and is waterproof up to a depth of 6 meters. It is made of self-made high-strength 7-series aluminum alloy and aerospace-grade materials, with a total bending strength of 100kg. This smartphone will have Honor Sound stereo dual speakers.

Talking about Honor Magic 8 RSR, this smartphone will officially come with Snapdragon 8 Elite Gen 5 SoC and it will have 24GB LPDDR5X RAM. It also supports multiple focal lengths 23mm, 46mm, 50mm and 85mm.

Read :- Nubia Z80 Ultra launched with Snapdragon 8 Elite Gen 5 SoC and 7200mAh battery; check details